Infineon Technologies AG and Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors.
Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030. Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.
Heung Soo Kim, Executive Vice President and Head of Global Strategy Office (GSO) at Hyundai Motor Group, said, “Infineon stands as a valued strategic partner, boasting production capabilities and technological prowess within the power semiconductor market. This partnership empowers Hyundai Motor and Kia to stabilize its semiconductor supply and solidify leadership in the global EV market, supported by competitive product lineups.”
Peter Schiefer, President of Infineon’s Automotive Division, said, “The future car will be clean, safe, and smart, with semiconductors at the heart of this transformation. As a trusted partner, we are proud to advance our long-term partnership with Hyundai/Kia. We provide high-quality products, system knowledge, and application understanding, along with continued investments in manufacturing capacity to address the increasing demand for automotive power electronics.”
Infineon’s power semiconductors play a crucial role in the transition to electromobility, driving market growth, especially for wide bandgap materials like SiC. Infineon will expand its Kulim fab to build the world’s largest 200-millimeter SiC power fab, strengthening its position as a high-quality, high-volume supplier to the automotive industry. This expansion in Kulim complements Infineon’s current manufacturing capacity in Villach, Austria, and further capacity expansions in Dresden, Germany, as part of its multi-site strategy.
